#2.5d technology portable#

eWLB's flexible reconstitution manufacturing process can reduce substrate complexity and costs while achieving high performance, smaller package sizes with very dense interconnection in a range of reliable, low-warpage 2D, 2.5D and 3D solutions. JCET has been actively pushing the boundaries of traditional packaging paradigms by pioneering a number of enabling integration technologies in wafer level packaging, flip chip interconnect and Through Silicon Via (TSV) to develop differentiated solutions that position its customers for success in the markets they serve.ДЈD integration is proceeding on three fronts: package level, wafer level and silicon level integration.Д®mbedded Wafer Level BGA (eWLB) - a versatile Fan-Out embedded Wafer Level BGA platform. To meet this demand, various types of stacking integration technologies are being used to combine multiple chips with diverse functionality into increasingly smaller and smaller sizes. Accelerated by the need for higher levels of integration, improved electrical performance, or reduction of timing delays, the requirements for shorter vertical interconnects is forcing a shift in packaging technology from 2D packaging to more advanced 2.5D and 3D package designs.

#2.5d technology portable#

The market for portable and mobile data access devices is growing rapidly, driving the demand for both increased functional convergence as well as increased packaging complexity and sophistication.